PCB etching machine
Product Description
PCB etching machine Product features
1. Independently adjustable horizontal swing nozzle waterproof pool effect design, spraying more evenly, more smooth production.
2. Configuration of mechanical (or vacuum) bubble-breaking device, to avoid defoamer pollution, effectively reduce the waste of liquid.
3. Precision compensation etching design, effective control of pool effect, to improve the uniformity of the board, etching line width line distance: 2mil/2mil, etching uniformity C.O.V ≥ 96%, etching factor ≥ 5.
4. Cross-slanting spraying for more effective flushing of the receding film.
5. Cone roller type membrane slag separation system, which can collect and process membrane slag efficiently and cleanly. Equipment outside dimensions: 13848mm(L) * 2500mm(W) * 2500±25mm(H) (Production speed is roughly proportional to equipment length)
PCB board size:
● Max.: 610 mm * 610 mm ● Min.: 200 mm * 200 mm
● Thickness: 0.05 - 3.2 mm (Excluding copper) (Standard: 35 axis distance)
● Production speed: 0.6 - 8 m/min (Adjustable) (Work output preset: 2.5 m/min)
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